The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 16, 2024

Filed:

Jul. 21, 2022
Applicant:

Commscope Technologies Llc, Hickory, NC (US);

Inventors:

Runmiao Wu, Suzhou, CN;

Hangsheng Wen, Suzhou, CN;

Xun Zhang, Suzhou, CN;

Assignee:

CommScope Technologies LLC, Hickory, NC (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/14 (2006.01);
U.S. Cl.
CPC ...
H05K 1/144 (2013.01); H05K 2201/042 (2013.01); H05K 2201/10098 (2013.01);
Abstract

The present disclosure relates to a printed circuit board assembly, which includes: a first printed circuit board, printed with a first transmission trace; a second printed circuit board, printed with a second transmission trace; a substrate, in which, the provides a through aperture for a radio frequency connector; and a radio frequency connector, which includes an inner contact portion, an housing and an insulating part provided between the inner contact portion and housing, where the radio frequency connector is configured to be received in and pass through the through aperture, such that a first end of the inner contact portion of the radio frequency connector is electrically connected to the first transmission trace and a second end thereof is electrically connected to the second transmission trace, so that a first end of the housing of the radio frequency connector is electrically connected to a ground layer of the first printed circuit board and a second end thereof is electrically connected to the ground layer of the second printed circuit board. Thus, the printed circuit board assembly is capable of improving aspects such as shielding effects, PIN performance and/or degree of integration compared with prior art.


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