The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 16, 2024

Filed:

Jul. 14, 2022
Applicant:

First Hi-tec Enterprise Co., Ltd., Taoyuan, TW;

Inventors:

Ching-Shan Chang, Taoyuan, TW;

Kun-Tao Tang, Taoyuan, TW;

Tsung-Ting Tsai, Taoyuan, TW;

Chien-Lin Chen, Taoyuan, TW;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/02 (2006.01); H05K 1/11 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0228 (2013.01); H05K 1/025 (2013.01); H05K 1/111 (2013.01); H05K 2201/09236 (2013.01); H05K 2201/09545 (2013.01); H05K 2201/09718 (2013.01);
Abstract

A circuit board comprises a substrate with opposite first and second sides. A pair of plated through holes (PTHs) extends along z-axis. A pair of signal traces are made on the first side of the substrate and electrically coupled to the pair of the PTHs respectively to form a differential pair. A ground metal is made on the second side of the substrate, the ground metal has a clearance made therein. The ground metal extends fully overlapping with the full signal traces to eliminate reflection noise caused by a boundary between the clearance and the metal ground.


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