The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 16, 2024

Filed:

Apr. 22, 2022
Applicant:

Merry Electronics(shenzhen) Co., Ltd., ShenZhen, CN;

Inventor:

Ming-Xue Cai, Taichung, TW;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H04R 1/08 (2006.01); H04R 1/10 (2006.01);
U.S. Cl.
CPC ...
H04R 1/1008 (2013.01); H04R 1/08 (2013.01); H04R 1/1058 (2013.01);
Abstract

An earmuff module of a headphone includes a back cover, a sound-receiving hole, a microphone assembly, and an earmuff. The back cover includes a peripheral side wall. The sound-receiving hole is formed on the peripheral side wall of the back cover and penetrates through the peripheral side wall. The microphone assembly is disposed on an inner surface of the peripheral side wall and corresponds to the sound-receiving hole, and is acoustically connected with the sound-receiving hole. The earmuff is detachably assembled on the back cover, and the earmuff includes a foam and a wrapping cover. The wrapping cover includes an extension part and a covering part. The covering part covers the foam. The extension part extends from one end of the covering part to an outer surface of the peripheral side wall and covers the sound-receiving hole. The microphone assembly is located within a range covered by the extension part.


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