The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 16, 2024

Filed:

Oct. 05, 2018
Applicant:

Dana Canada Corporation, Oakville, CA;

Inventor:

Benjamin Kenney, Oakville, CA;

Assignee:

DANA CANADA CORPORATION, Oakville, CA;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01M 10/6556 (2014.01); F28D 1/03 (2006.01); F28F 21/00 (2006.01); F28F 9/00 (2006.01); H01M 50/209 (2021.01); H01M 50/271 (2021.01); H01M 10/613 (2014.01); H01M 10/625 (2014.01); H01M 10/6554 (2014.01); H01M 10/6568 (2014.01); F28F 3/12 (2006.01); F28D 21/00 (2006.01);
U.S. Cl.
CPC ...
H01M 10/6556 (2015.04); F28D 1/0383 (2013.01); F28F 3/12 (2013.01); F28F 9/001 (2013.01); F28F 21/00 (2013.01); H01M 10/613 (2015.04); H01M 10/625 (2015.04); H01M 10/6554 (2015.04); H01M 10/6568 (2015.04); H01M 50/209 (2021.01); H01M 50/271 (2021.01); F28D 2021/0028 (2013.01); F28D 2021/0043 (2013.01); F28F 2230/00 (2013.01); F28F 2270/00 (2013.01);
Abstract

A heat exchanger having an integrated support structure particularly suited for thermal management of heat generating components such as battery thermal management applications or thermal management of other electronic components is disclosed. The heat exchanger includes a top plate and a base tray defining a plurality of fluid channels that extend between an inlet manifold area and an outlet manifold area. The top plate has a first side defining a primary heat transfer area and a second side for effecting a sealing relationship between the top plate and the base tray. In some instances, the top plate includes a thermally conductive material while the base tray includes a non-thermally conductive material. In some instances the base tray cooperates with a cover portion to define an enclosure for housing the heat generating components.


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