The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 16, 2024

Filed:

Jun. 28, 2019
Applicant:

Kyocera Corporation, Kyoto, JP;

Inventors:

Akihiko Kitagawa, Kyoto, JP;

Yoshiaki Itakura, Kyoto, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 33/48 (2010.01); H01L 33/62 (2010.01); H01L 33/46 (2010.01); H01L 33/60 (2010.01);
U.S. Cl.
CPC ...
H01L 33/486 (2013.01); H01L 33/46 (2013.01); H01L 33/60 (2013.01); H01L 33/62 (2013.01);
Abstract

An electronic component mounting package includes: a substrate with ceramic as a base material, the substrate including a cavity having a bottom surface where an electronic component mounting part is located and an inner periphery that has a corner part and a straight part; and an inner peripheral surface where a first metal film is located, the first metal film having a thickness larger at the straight part than at the corner part on the inner periphery having a single distance from the bottom surface or the first metal film having a surface roughness larger at the straight part than at the corner part on the inner periphery having a single distance from the bottom surface.


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