The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 16, 2024
Filed:
Sep. 02, 2021
Commissariat a L'energie Atomique ET Aux Energies Alternatives, Paris, FR;
Centre National DE LA Recherche Scientifique, Paris, FR;
Universite DE Bordeaux, Bordeaux, FR;
Institut Polytechnique DE Bordeaux, Talence, FR;
Maxime Bronchy, Grenoble, FR;
Etienne Duguet, Begles, FR;
Céline Feautrier, Grenoble, FR;
Mona Treguer-Delapierre, Villenave d'Ornon, FR;
COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES, Paris, FR;
CENTRE NATIONAL DE LA RECHERCHE SCIENTIFIQUE, Paris, FR;
UNIVERSITE DE BORDEAUX, Bordeaux, FR;
INSTITUT POLYTECHNIQUE DE BORDEAUX, Paris, FR;
Abstract
A method for interconnecting components of an electronic system includes depositing a sintering solution onto a first component to form an interconnection layer, the sintering solution comprising a solvent, metal nanoparticles dispersed in the solvent, and a stabilizing agent adsorbed onto the nanoparticles. More than 95.0%, preferably more than 99.0% of the mass of the nanoparticles include a metal selected from silver, gold, copper and alloys thereof and have a polyhedral shape with an aspect ratio greater than 0.8. The method also includes eliminating, at least partially, the solvent from the layer to form an ordered agglomerate in which the nanoparticles are regularly disposed in three axes, the stabilizing agent binding them together and maintaining at least a portion of the nanoparticles at a distance from each other, debinding and sintering the layer, and depositing a second component in contact with the layer before or during debinding or sintering.