The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 16, 2024

Filed:

Nov. 21, 2022
Applicant:

Ii-vi Delaware, Inc., Wilmington, DE (US);

Inventors:

Po Dong, Cupertino, CA (US);

Juthika Basak, San Jose, CA (US);

Jiashu Chen, Los Altos, CA (US);

Assignee:

II-VI DELAWARE, INC., Wilmington, DE (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G02B 6/30 (2006.01); G02B 6/42 (2006.01);
U.S. Cl.
CPC ...
G02B 6/30 (2013.01); G02B 6/421 (2013.01); G02B 6/4249 (2013.01); G02B 6/4274 (2013.01);
Abstract

A modular assembly for opto-electronic systems has a substrate on which various photonic integrated circuit (PIC) chips and electronic integrated circuit (EIC) chips are mounted. One or more waveguide (WG) chips mounted on the substrate align the optical communication between the PIC chips and fiber blocks for optical fibers. Preconfigured electrical connections in the substrate allow the PIC and EIC chips to communicate with one another and to communicate with solder bumps on the substrate for integration of the modular assembly with other electronic components.


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