The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 16, 2024
Filed:
Dec. 28, 2021
Rockwell Collins, Inc., Cedar Rapids, IA (US);
Yehia F. Khalil, Glastonbury, CT (US);
Rockwell Collins, Inc., Cedar Rapids, IA (US);
Abstract
A system and method for performing time-dependent reliability prediction of a printed circuit board (PCB) embedded in a sensor that monitors the health (viz., performance) of operating equipment subject to different environmental stressors. The method includes developing a digital twin (DT) of the physical PCB, generating sensor data, transmitting the sensor data, and receiving sensor data and historical conditional data by the twinning module, wherein the historical condition data includes known failure data of one or more electronic components of the circuit board based on an internal condition or and external condition. The method further includes embedded physics-based reliability models informed by inputs from the sensor data and the historical conditional data, generating a real-time failure prediction signal based on the physics-based reliability models, and reporting the real-time failure prediction signal. The circuit board may include printed circuit boards (PCBs), particularly additively-manufactured printed circuit boards (AM-PCBs).