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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11873398 B1

PDFFull Text
Date of Patent:
Jan. 16, 2024

Filed:

Sep. 28, 2017

Interlayer insulating material and multilayer printed wiring board

Applicant:

Sekisui Chemical Co., Ltd., Osaka, JP;

Inventors:

Tatsushi Hayashi, Tsukuba, JP;

Takashi Nishimura, Tsukuba, JP;

Susumu Baba, Tsukuba, JP;

Assignee:

SEKISUI CHEMICAL CO., LTD., Osaka, JP;

Attorney:

Cheng Law Group, PLLC

Primary Examiner:

John D Freeman

Int. Cl.
CPC ...
C08L 63/00 (2006.01); B32B 15/20 (2006.01); B32B 27/28 (2006.01); B32B 27/38 (2006.01); H05K 1/02 (2006.01); H05K 1/03 (2006.01); B32B 15/092 (2006.01); B32B 27/08 (2006.01); B32B 27/20 (2006.01);
U.S. Cl.
CPC ...
C08L 63/00 (2013.01); B32B 15/092 (2013.01); B32B 15/20 (2013.01); B32B 27/08 (2013.01); B32B 27/20 (2013.01); B32B 27/281 (2013.01); B32B 27/38 (2013.01); H05K 1/0298 (2013.01); H05K 1/0353 (2013.01); B32B 2307/202 (2013.01); B32B 2307/206 (2013.01); B32B 2457/08 (2013.01); C08L 2203/16 (2013.01); C08L 2203/20 (2013.01); H05K 2201/0154 (2013.01);
Abstract

Provided is an interlayer insulating material that can enhance the adhesion between an insulating layer and a metal layer, and can reduce the surface roughness on a surface of the insulating layer. The present invention is an interlayer insulating material used for a multilayer printed wiring board, which contains an epoxy compound, a curing agent, a silica, and a polyimide, and in which the polymide is a reactant of a tetracarboxylic anhydride and a dimer acid diamine, a content of the silica is 30% by weight or more and 90% by weight or less in 100% by weight of components excluding a solvent in the interlayer insulating material, and the total content of the epoxy compound and the curing agent in 100% by weight of components excluding the silica and a solvent in the interlayer insulating material is 65% by weight or more.

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