The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 16, 2024
Filed:
Oct. 17, 2019
Toray Industries, Inc., Tokyo, JP;
Mitsuki Fuse, Nagoya, JP;
Satoshi Seike, Nagoya, JP;
Akihiko Matsui, Nagoya, JP;
Kazuma Ura, Nagoya, JP;
Toray Industries, Inc., Tokyo, JP;
Abstract
A fiber-reinforced resin material used for molding a fiber-reinforced resin which includes a matrix resin and reinforcing fiber bundles A including chopped fiber bundles each including 100 or more single fibers, wherein the product of an average porosity within fiber bundles P(−) and an average fiber bundle thickness t(mm) is 0 mm or more and 0.01 mm or less and a porosity of composite P(−) is 0.02 or more and 0.4 or less, and a method for producing the same. The fiber-reinforced resin material is a molding material excellent in terms of productivity and reduction in LCA, which can give high mechanical properties to a molded article using the molding material and further which is excellent also in flowability during molding.