The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 16, 2024

Filed:

Apr. 14, 2022
Applicant:

Benq Materials Corporation, Taoyuan, TW;

Inventors:

Feng-Yu Chiu, Taoyuan, TW;

Ju-Hui Huang, Taoyuan, TW;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
A61C 5/77 (2017.01); C08F 2/46 (2006.01); C08F 2/50 (2006.01); C08G 61/04 (2006.01); C08F 265/06 (2006.01);
U.S. Cl.
CPC ...
C08F 265/06 (2013.01);
Abstract

The disclosure related to a resin composition for molding device for dental restoration comprising 10 to 50 parts by weight of an urethane acrylate oligomer with a functionality less than 4, 20 to 40 parts by weight of morpholino-group containing acrylate monomera morpholino-group containing acrylate monomer, 10 to 40 parts by weight of a polymerizable acrylate monomer composition and 0.5 to 5 parts by weight of a photoinitiator, wherein the polymerizable acrylate monomer composition comprises 40 to 60 parts by weight of an alicyclic acrylate monomer and 40 to 60 parts by weight of ether-bond containing aliphatic acrylate monomeran ether-bond containing aliphatic acrylate monomer. The shore hardness of the resin composition after being cured of the present invention is not less than 70D and the flexural strain thereof is not less than 0.15.


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