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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11872755 B1

PDFFull Text
Date of Patent:
Jan. 16, 2024

Filed:

Apr. 28, 2020

Method for manufacturing product, and additive manufacturing apparatus

Applicant:

Canon Kabushiki Kaisha, Tokyo, JP;

Inventors:

Yoshiyuki Beniya, Abiko, JP;

Kota Kiyohara, Yokohama, JP;

Hitoshi Murao, Tokyo, JP;

Assignee:

CANON KABUSHIKI KAISHA, Tokyo, JP;

Attorney:

Venable LLP

Primary Examiner:

Joseph S Del Sole

Assistant Examiner:

Margaret B Hayes

Int. Cl.
CPC ...
B29C 64/393 (2017.01); B29C 64/245 (2017.01); B29C 64/214 (2017.01); B29C 64/153 (2017.01); B33Y 10/00 (2015.01); B33Y 30/00 (2015.01); B33Y 50/02 (2015.01); B22F 10/30 (2021.01); B22F 10/14 (2021.01); B22F 10/28 (2021.01); B22F 12/60 (2021.01); B22F 12/90 (2021.01); B22F 10/47 (2021.01); B22F 10/85 (2021.01); B22F 12/30 (2021.01); B22F 12/63 (2021.01); B22F 10/50 (2021.01);
U.S. Cl.
CPC ...
B29C 64/245 (2017.08); B22F 10/14 (2021.01); B22F 10/28 (2021.01); B22F 10/30 (2021.01); B22F 10/47 (2021.01); B22F 10/85 (2021.01); B22F 12/60 (2021.01); B22F 12/90 (2021.01); B29C 64/153 (2017.08); B29C 64/214 (2017.08); B29C 64/393 (2017.08); B33Y 10/00 (2014.12); B33Y 30/00 (2014.12); B33Y 50/02 (2014.12); B22F 10/50 (2021.01); B22F 12/30 (2021.01); B22F 12/63 (2021.01);
Abstract

An additive manufacturing apparatus includes a supporting portion, a powder supplying portion, a flattening member, a curing portion, and a controller. The supporting portion is configured to detachably support a shaping stage. The powder supplying portion is configured to supply powder. The flattening member is configured to move in a scanning manner above the shaping stage attached to the supporting portion. The controller is configured to execute a measuring process of detecting inclination between a shaping surface of the shaping stage attached to the supporting portion and a trajectory plane of a trajectory of scanning movement of the flattening member, an adjustment process of adjusting an orientation of the shaping stage on a basis of a detection result of the measuring process such that a degree of parallel between the shaping surface and the trajectory plane increases, a powder layer formation process, and a curing process.

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