The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 16, 2024
Filed:
Feb. 15, 2021
Applicant:
International Business Machines Corporation, Armonk, NY (US);
Inventors:
Sarah K. Czaplewski, Rochester, MN (US);
Joseph F. Doman, Raleigh, NC (US);
Joseph Kuczynski, North Port, FL (US);
Assignee:
International Business Machines Corporation, Armonk, NY (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B29D 11/00 (2006.01); B29C 41/02 (2006.01); B29C 41/00 (2006.01); B29C 41/46 (2006.01); B29C 41/42 (2006.01); B29C 41/50 (2006.01); H05K 3/42 (2006.01); B29K 83/00 (2006.01); B29K 75/00 (2006.01); B29L 31/00 (2006.01);
U.S. Cl.
CPC ...
B29C 41/02 (2013.01); B29C 41/003 (2013.01); B29C 41/42 (2013.01); B29C 41/46 (2013.01); B29C 41/50 (2013.01); H05K 3/429 (2013.01); B29K 2075/00 (2013.01); B29K 2083/00 (2013.01); B29L 2031/757 (2013.01); H05K 2203/16 (2013.01);
Abstract
Circuit feature casting for manufacture observation is disclosed herein. According to an aspect, a method includes applying a molding material to a feature of a circuit to substantially cover the feature with the molding material. The method also includes curing the molding material. Further, the method includes separating the molding material from the feature to reveal a cast of the feature of the circuit.