The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 16, 2024
Filed:
Oct. 28, 2020
Osaka University, Suita, JP;
Hidetoshi Fujii, Suita, JP;
Yoshiaki Morisada, Suita, JP;
Yasuhiro Aoki, Suita, JP;
Masayoshi Kamai, Suita, JP;
OSAKA UNIVERSITY, Suita, JP;
Abstract
A dissimilar material solid phase bonding method is disclosed wherein one member and another member having different compositions are brought into contact with one another by way of an insert material to form an interface () to be bonded, at which the one member and the insert material are in contact with one another, and an interface () to be bonded, at which the other member and the insert material are in contact with one another; the temperature of the interface () to be bonded and the interface () to be bonded is raised by means of frictional heat and/or by electrical heating; a bonding pressure () is applied substantially perpendicular to the interface () to be bonded; a bonding pressure () is applied substantially perpendicular to the interface () to be bonded; and the bonding pressure () and the bonding pressure () are set to different values.