The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 16, 2024
Filed:
Dec. 26, 2019
Jx Nippon Mining & Metals Corporation, Tokyo, JP;
Hirofumi Watanabe, Ibaraki, JP;
Hiroyoshi Yamamoto, Ibaraki, JP;
Yoshitaka Shibuya, Ibaraki, JP;
Kenji Sato, Tokyo, JP;
Satoru Morioka, Tokyo, JP;
Akihiko Chiba, Miyagi, JP;
Kenta Aoyagi, Miyagi, JP;
JX METALS CORPORATION, Tokyo, JP;
Abstract
A production method of an additive manufactured object is provided. The method is an EB-based additive manufacturing method of spreading a pure copper powder, preheating the pure copper powder and thereafter partially melting the pure copper powder by scanning the pure copper powder with an electron beam, solidifying the pure copper powder to form a first layer, newly spreading a pure copper powder on the first layer, preheating the pure copper powder and thereafter partially melting the pure copper powder by scanning the pure copper powder with an electron beam, solidifying the pure copper powder to form a second layer, and repeating the foregoing process to add layers. The pure copper powder is a pure copper powder with a Si coating formed thereon, and the preheating temperature is set to be 400° C. or higher and less than 800° C.