The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 16, 2024

Filed:

Apr. 26, 2021
Applicant:

Koito Manufacturing Co., Ltd., Tokyo, JP;

Inventors:

Naoki Tatara, Shizuoka, JP;

Toshihiro Okamura, Shizuoka, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B08B 5/02 (2006.01); F21V 19/00 (2006.01); F21V 23/00 (2015.01); B60Q 1/00 (2006.01); B60S 1/08 (2006.01); B60S 1/56 (2006.01); B60S 1/54 (2006.01); B60R 1/00 (2022.01); B60Q 1/26 (2006.01); H04N 23/50 (2023.01); H04N 23/55 (2023.01); H04N 23/56 (2023.01); H04N 23/57 (2023.01); H04N 23/63 (2023.01); B60Q 1/38 (2006.01); F21S 43/19 (2018.01); B60Q 9/00 (2006.01); B60R 11/00 (2006.01);
U.S. Cl.
CPC ...
B08B 5/02 (2013.01); B60Q 1/0023 (2013.01); B60Q 1/2661 (2013.01); B60Q 1/381 (2022.05); B60Q 9/008 (2013.01); B60R 1/00 (2013.01); B60S 1/0848 (2013.01); B60S 1/54 (2013.01); B60S 1/56 (2013.01); F21S 43/19 (2018.01); F21V 19/00 (2013.01); F21V 23/00 (2013.01); H04N 23/50 (2023.01); H04N 23/55 (2023.01); H04N 23/56 (2023.01); H04N 23/57 (2023.01); H04N 23/633 (2023.01); B60R 2011/004 (2013.01); B60R 2300/103 (2013.01); B60R 2300/307 (2013.01); B60R 2300/804 (2013.01); B60R 2300/8046 (2013.01); B60R 2300/8066 (2013.01);
Abstract

The present invention is provided with: an outer housing configured from a housing having an opening, and a translucent cover closing the opening; a substrate disposed inside of the outer hosing; a camera module, which has an image pickup element, and is disposed on the substrate; and a light emitting element, which is provided as a light source, and is disposed on the substrate. Consequently, since the camera module and the light emitting element are disposed on the substrate that is disposed inside of the outer housing, the number of configuration components is small, thereby achieving reduction of the number of components, and size reduction.


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