The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 16, 2024

Filed:

Jul. 12, 2022
Applicant:

Ford Motor Company, Dearborn, MI (US);

Inventors:

Christopher Michael Seubert, New Hudson, MI (US);

Mark Edward Nichols, Saline, MI (US);

Kevin Richard John Ellwood, Ann Arbor, MI (US);

Wanjiao Liu, Ann Arbor, MI (US);

Aaron M. Fiala, Newport, MI (US);

Assignee:

Ford Motor Company, Dearborn, MI (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B05B 12/04 (2006.01); B05B 12/14 (2006.01); B05B 12/18 (2018.01); B41J 3/407 (2006.01); B05B 17/00 (2006.01); B05D 1/02 (2006.01); B05B 13/04 (2006.01);
U.S. Cl.
CPC ...
B05B 17/0638 (2013.01); B05B 12/04 (2013.01); B05B 12/14 (2013.01); B05B 12/18 (2018.02); B05D 1/02 (2013.01); B41J 3/407 (2013.01); B05B 13/0452 (2013.01); B05B 17/0646 (2013.01);
Abstract

A method of controlling application of at least one material onto a substrate includes configuring a material applicator having an array plate with an applicator array. The applicator array has a plurality of micro-applicators with a first subset of micro-applicators and a second subset of micro-applicators. Each of the plurality of micro-applicators has a plurality of apertures through which fluid is ejected. The first subset of micro-applicators and the second subset of micro-applicators are individually addressable, and a liquid flows through the first subset of micro-applicators and a shaping gas, e.g., air, flows through the second subset of micro-applicators. The flow of shaping gas shapes the flow of the liquid from the first subset of micro-applicators to the substrate.


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