The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 16, 2024

Filed:

Aug. 09, 2022
Applicant:

Stamford Devices Limited, Dangan, IE;

Inventors:

Brendan Hogan, Gort, IE;

Hong Xu, Redwood City, CA (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B05B 1/02 (2006.01); B05B 17/00 (2006.01); B05B 1/06 (2006.01); C25D 7/04 (2006.01); C25D 1/08 (2006.01); B05B 17/06 (2006.01); A61M 11/00 (2006.01); A61M 15/00 (2006.01);
U.S. Cl.
CPC ...
B05B 1/02 (2013.01); B05B 17/0638 (2013.01); B05B 17/0653 (2013.01); C25D 1/08 (2013.01); C25D 7/04 (2013.01); A61M 11/005 (2013.01); A61M 15/0085 (2013.01); A61M 2207/00 (2013.01);
Abstract

An aperture plate is manufactured by plating metal around a mask of resist columns having a desired size, pitch, and profile, which yields a wafer about 60 μm thickness. This is approximately the full desired target aperture plate thickness. The plating is continued so that the metal overlies the top surfaces of the columns until the desired apertures are achieved. This needs only one masking/plating cycle to achieve the desired plate thickness. Also, the plate has passageways formed beneath the apertures, formed as an integral part of the method, by mask material removal. These are suitable for entrainment of aerosolized droplets exiting the apertures.


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