The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 09, 2024
Filed:
Jun. 16, 2021
Applicant:
Nec Corporation, Tokyo, JP;
Inventors:
Kenji Nanba, Tokyo, JP;
Ayami Yamaguchi, Tokyo, JP;
Akira Miyata, Tokyo, JP;
Katsumi Kikuchi, Tokyo, JP;
Suguru Watanabe, Tokyo, JP;
Takanori Nishi, Tokyo, JP;
Hideyuki Satou, Tokyo, JP;
Assignee:
NEC CORPORATION, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H10N 60/81 (2023.01); H01L 23/498 (2006.01); H01L 23/34 (2006.01); H10N 60/01 (2023.01); G06N 10/00 (2022.01);
U.S. Cl.
CPC ...
H10N 60/81 (2023.02); H01L 23/34 (2013.01); H01L 23/49822 (2013.01); H01L 23/49838 (2013.01); H10N 60/01 (2023.02); G06N 10/00 (2019.01); H01L 23/49827 (2013.01); H01L 23/49888 (2013.01);
Abstract
A quantum device () includes: an interposer (); a quantum chip (); a first connection part () that is provided between the interposer () and the quantum chip () and electrically connects a wiring layer of the interposer () to a wiring layer of the quantum chip (); and a second connection part () that is provided on a main surface of the interposer () where the first connection part () is arranged and is connected to a cooling plate ().