The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 09, 2024

Filed:

Sep. 02, 2020
Applicant:

Kioxia Corporation, Tokyo, JP;

Inventors:

Takayuki Kashima, Yokkaichi Mie, JP;

Hiroyasu Sato, Yokkaichi Mie, JP;

Assignee:

KIOXIA CORPORATION, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H10B 43/50 (2023.01); H01L 21/3213 (2006.01); H01L 21/311 (2006.01); H10B 43/10 (2023.01); H10B 43/27 (2023.01); H10B 43/35 (2023.01); H10B 43/40 (2023.01);
U.S. Cl.
CPC ...
H10B 43/50 (2023.02); H01L 21/31116 (2013.01); H01L 21/31144 (2013.01); H01L 21/32136 (2013.01); H01L 21/32139 (2013.01); H10B 43/10 (2023.02); H10B 43/27 (2023.02); H10B 43/35 (2023.02); H10B 43/40 (2023.02);
Abstract

According to one embodiment, a semiconductor storage device includes a substrate; a stacked body provided above the substrate, wherein the stacked body includes a plurality of first insulating layers and a plurality of conductive layers that are alternately stacked on top of one another along a vertical direction; a plurality of columnar portions that penetrate the stacked body; a first slit, provided in the vertical direction, that divides one or more of the plurality of conductive layers at least at an upper portion of the stacked body; and a second insulating layer that overlays an opening of the first slit, which forms a cavity.


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