The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 09, 2024

Filed:

Dec. 23, 2021
Applicant:

Lodestar Licensing Group Llc, Evanston, IL (US);

Inventors:

Shyam Surthi, Boise, ID (US);

Davide Resnati, Vimercate, IT;

Paolo Tessariol, Arcore, IT;

Richard J. Hill, Boise, ID (US);

John D. Hopkins, Meridian, ID (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 27/11582 (2017.01); H01L 27/11556 (2017.01); H01L 29/51 (2006.01); H01L 21/28 (2006.01); H01L 21/02 (2006.01); H01L 29/788 (2006.01); H01L 29/792 (2006.01); H10B 43/27 (2023.01); H01L 29/49 (2006.01); H10B 41/27 (2023.01);
U.S. Cl.
CPC ...
H10B 43/27 (2023.02); H01L 21/0214 (2013.01); H01L 21/0217 (2013.01); H01L 21/02164 (2013.01); H01L 21/02236 (2013.01); H01L 29/40114 (2019.08); H01L 29/40117 (2019.08); H01L 29/4991 (2013.01); H01L 29/513 (2013.01); H01L 29/517 (2013.01); H01L 29/7883 (2013.01); H01L 29/792 (2013.01); H10B 41/27 (2023.02);
Abstract

Some embodiments include a NAND memory array having a vertical stack of alternating insulative levels and conductive levels. The conductive levels include control gate regions. High-k dielectric material is adjacent to the control gate regions and is configured as an arrangement of first vertically-extending linear segments which are vertically spaced from one another. Charge-blocking material is adjacent to the high-k dielectric material and is configured as an arrangement of second vertically-extending linear segments which are vertically spaced from one another. Charge-storage material is adjacent to the charge-blocking material and is configured as an arrangement of third vertically-extending linear segments which are vertically spaced from one another. Gate-dielectric material is adjacent to the charge-storage material. Channel material extends vertically along the stack and is adjacent to the gate-dielectric material. Some embodiments include integrated assemblies and methods of forming integrated assemblies.


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