The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 09, 2024
Filed:
May. 08, 2020
Applicant:
Sony Group Corporation, Tokyo, JP;
Inventor:
Hiroto Yamada, Tokyo, JP;
Assignee:
SONY GROUP CORPORATION, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 7/20 (2006.01); G06F 1/20 (2006.01); G06F 1/16 (2006.01); H04N 23/52 (2023.01);
U.S. Cl.
CPC ...
H05K 7/20963 (2013.01); G06F 1/163 (2013.01); G06F 1/206 (2013.01); H05K 7/2049 (2013.01); H04N 23/52 (2023.01);
Abstract
Provided is a heat conduction mechanism including: a first member including at least one heat source; a second member including a heat dissipation element, the second member displaceable with respect to the first member; and a heat conductive sheet that transfers heat of the heat source to the heat dissipation element, in which a protective sheet is provided to a portion of the heat conductive sheet that can be in contact with at least a part of the first member or the second member.