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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11871524 B1

PDFFull Text
Date of Patent:
Jan. 09, 2024

Filed:

Aug. 21, 2017

Component-incorporated substrate and method for manufacturing same

Applicant:

Fujikura Ltd., Tokyo, JP;

Inventor:

Masahiro Okamoto, Tokyo, JP;

Assignee:

Fujikura Ltd., Tokyo, JP;

Attorney:

Osha Bergman Watanabe & Burton LLP

Primary Examiner:

Ishwarbhai B Patel

Int. Cl.
CPC ...
H05K 1/03 (2006.01); H05K 1/11 (2006.01); H05K 1/18 (2006.01); H05K 3/46 (2006.01); H05K 3/00 (2006.01); H05K 3/10 (2006.01); H05K 1/00 (2006.01); H01L 23/12 (2006.01); H05K 1/02 (2006.01); H01L 23/498 (2006.01);
U.S. Cl.
CPC ...
H05K 3/46 (2013.01); H01L 23/12 (2013.01); H05K 1/00 (2013.01); H05K 1/03 (2013.01); H05K 1/112 (2013.01); H05K 1/183 (2013.01); H05K 3/0008 (2013.01); H05K 3/103 (2013.01); H01L 23/49822 (2013.01); H01L 23/49827 (2013.01); H05K 1/0251 (2013.01);
Abstract

A component-incorporated substrate of multi-layer structure includes: a plurality of printed wiring base members that are batch-laminated via an adhesive layer, with the plurality of printed wiring base members including a resin base member that includes a wiring pattern on at least one surface thereof and a via connected to the wiring pattern; an opening disposed in at least one printed wiring base member that is sandwiched on both sides by other printed wiring base members of the plurality of printed wiring base members; and an electronic component disposed in the opening. At least part of the wiring pattern of the printed wiring base member where the opening is formed is disposed in a frame shape surrounding the opening, in a periphery of the opening.

Find Patent Forward Citations

Quick Actions:

Okamoto, Masahiro. (2024). Component-incorporated substrate and method for manufacturing same (U.S. Patent No. 11871524). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11871524

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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