The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 09, 2024
Filed:
May. 10, 2022
Applicant:
Murata Manufacturing Co., Ltd., Nagaokakyo, JP;
Inventors:
Ryohei Okabe, Nagaokakyo, JP;
Toru Komatsu, Nagaokakyo, JP;
Assignee:
MURATA MANUFACTURING CO., LTD., Kyoto, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/18 (2006.01); H05K 3/28 (2006.01); H01L 23/28 (2006.01); H05K 9/00 (2006.01);
U.S. Cl.
CPC ...
H05K 3/284 (2013.01); H01L 23/28 (2013.01); H05K 1/181 (2013.01); H05K 9/0073 (2013.01); H05K 2203/025 (2013.01); H05K 2203/0264 (2013.01); H05K 2203/107 (2013.01);
Abstract
An electronic component module includes a substrate, an electronic component, an insulating resin, and a shield film. The insulating resin covers a first main surface side of the substrate. The insulating resin exposes an opposite surface of the electronic component. The shield film covers the insulating resin and the opposite surface of the electronic component. The opposite surface has an uneven portion. A concave portion of the uneven portion has a smoother shape than a convex portion of the uneven portion.