The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 09, 2024
Filed:
Mar. 26, 2021
Applicants:
Sumitomo Electric Industries, Ltd., Osaka, JP;
Sumitomo Electric Printed Circuits, Inc., Koka, JP;
Inventors:
Kenji Takahashi, Osaka, JP;
Shoichiro Sakai, Osaka, JP;
Assignees:
SUMITOMO ELECTRIC INDUSTRIES, LTD., Osaka, JP;
SUMITOMO ELECTRIC PRINTED CIRCUITS, INC., Koka, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 1/09 (2006.01); C25D 3/38 (2006.01); C25D 7/00 (2006.01); H05K 1/02 (2006.01); H05K 3/18 (2006.01);
U.S. Cl.
CPC ...
H05K 1/09 (2013.01); C25D 3/38 (2013.01); C25D 7/00 (2013.01); H05K 1/028 (2013.01); H05K 3/188 (2013.01);
Abstract
A flexible printed circuit board according to an aspect is a flexible printed circuit board including a base film and a wiring layer disposed on at least one surface of the base film and having a plurality of wiring lines. The wiring lines have an average line width of 30 μm or less and an average spacing of 30 μm or less. The wiring lines have a copper-based plating layer. The copper-based plating layer has an electrical resistivity of more than 1.68×10Ω·m.