The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 09, 2024

Filed:

Sep. 17, 2021
Applicant:

Raytheon Company, Waltham, MA (US);

Inventors:

Dave E. Swernofsky, Richardson, TX (US);

Robert S. Isom, Allen, TX (US);

Assignee:

Raytheon Company, Waltham, MA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01Q 21/00 (2006.01); H01Q 1/48 (2006.01); H01R 25/00 (2006.01); H05K 5/00 (2006.01); H01L 25/10 (2006.01); H01R 13/03 (2006.01);
U.S. Cl.
CPC ...
H01Q 1/48 (2013.01); H01Q 21/0025 (2013.01); H01R 25/006 (2013.01); H05K 5/0021 (2013.01); H01L 25/105 (2013.01); H01R 13/03 (2013.01);
Abstract

An assembly comprises a first subassembly, a second subassembly, and a conductive grounding element. The first subassembly comprises a first module comprising a first ground plane and a first conductive region in operable communication with the first ground plane. The second subassembly comprises a second module comprising a second ground plane distinct from the first ground plane and a second conductive region in operable communication with the second ground plane. The first and second subassemblies attach to each other along a seam. The conductive grounding element comprises an electrically conductive material including a first portion disposed adjacent to the first conductive region and a second portion disposed adjacent the second conductive region. The conductive grounding element is configured to fill one or more gaps in the seam and to operably couple together the first and second ground planes of the first and second subassemblies into a third common ground plane.


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