logo

For the Inventor, By the Inventor

The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11870021 B1

PDFFull Text
Date of Patent:
Jan. 09, 2024

Filed:

Jun. 14, 2022

Semiconductor light-emitting device and method for manufacturing the same

Applicant:

Rohm Co., Ltd., Kyoto, JP;

Inventors:

Tomoichiro Toyama, Kyoto, JP;

Ryo Kittaka, Kyoto, JP;

Assignee:

ROHM CO., LTD., Kyoto, JP;

Attorney:

Hamre, Schumann, Mueller & Larson, P.C.

Primary Examiner:

Antonio B Crite

Int. Cl.
CPC ...
H01L 33/56 (2010.01); H01L 33/00 (2010.01); H01L 33/54 (2010.01); H01L 33/62 (2010.01); H01L 33/48 (2010.01);
U.S. Cl.
CPC ...
H01L 33/56 (2013.01); H01L 33/0095 (2013.01); H01L 33/54 (2013.01); H01L 33/62 (2013.01); H01L 2933/0066 (2013.01);
Abstract

A semiconductor light-emitting device includes a substrate, a semiconductor light-emitting element, and a resin member. The substrate includes a base member and a conductive part. The semiconductor light-emitting element is supported on the substrate. The resin member covers at least a portion of the substrate. The base member has a front surface and a back surface that face opposite to each other in a thickness direction. The conductive part includes a front portion formed on the front surface. The semiconductor light-emitting element is mounted on the front portion. The resin member includes a frame-shaped portion surrounding the semiconductor light-emitting element as viewed in the thickness direction, and a front-surface covering portion connected to the frame-shaped portion and covering a portion of the front surface of the base member that is exposed from the front portion.

Find Patent Forward Citations

Toyama, Tomoichiro. (2024). Semiconductor light-emitting device and method for manufacturing the same (U.S. Patent No. 11870021). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11870021

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Loading…