The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 09, 2024
Filed:
Mar. 24, 2020
Applicant:
Tcl China Star Optoelectronics Technology Co., Ltd., Shenzhen, CN;
Inventor:
Hongquan Wei, Shenzhen, CN;
Assignee:
TCL CHINA STAR OPTOELECTRONICS TECHNOLOGY CO., LTD., Shenzhen, CN;
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 33/50 (2010.01); C09J 11/04 (2006.01); C09J 11/06 (2006.01); C09J 133/08 (2006.01); C09J 163/00 (2006.01); C09J 183/04 (2006.01); H01L 33/54 (2010.01);
U.S. Cl.
CPC ...
H01L 33/501 (2013.01); C09J 11/04 (2013.01); C09J 11/06 (2013.01); C09J 133/08 (2013.01); C09J 163/00 (2013.01); C09J 183/04 (2013.01); H01L 33/54 (2013.01);
Abstract
The present disclosure provides an encapsulated fluorescent adhesive layer, a method for manufacturing the same, and a quantum dot backlight. The quantum dot backlight includes a substrate, a light emitting chip, and the encapsulated fluorescent adhesive layer. The encapsulated fluorescent adhesive layer is used for heat transfer and heat dissipation.