The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 09, 2024

Filed:

Nov. 17, 2020
Applicant:

Semiconductor Components Industries, Llc, Phoenix, AZ (US);

Inventor:

Brian Patrick McGarvey, Templemartin, IE;

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 31/107 (2006.01); H01L 27/146 (2006.01); H01L 31/0232 (2014.01);
U.S. Cl.
CPC ...
H01L 31/107 (2013.01); H01L 27/14603 (2013.01); H01L 27/14609 (2013.01); H01L 27/14625 (2013.01); H01L 27/14643 (2013.01); H01L 31/02325 (2013.01);
Abstract

A semiconductor package may include a line array of single-photon avalanche diodes (SPADs). The line array of single-photon avalanche diodes may be split between multiple silicon dice. The silicon dice may have a staggered arrangement, with prisms on the package lid redirecting incident light to the silicon dice. The silicon dice may alternate between a first side of the package substrate and a second side of the package substrate. The prisms may alternate between a first structure that redirects incident light to the first side of the package substrate and a second structure that redirects incident light to the second side of the package substrate. The silicon dice may overlap to allow satisfactory alignment between the silicon dice and the prisms.


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