The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 09, 2024

Filed:

Sep. 09, 2021
Applicants:

Kabushiki Kaisha Toshiba, Tokyo, JP;

Toshiba Electronic Devices & Storage Corporation, Tokyo, JP;

Inventor:

Kohei Oasa, Setagaya, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/78 (2006.01); H01L 27/06 (2006.01); H01L 29/66 (2006.01); H01L 29/423 (2006.01);
U.S. Cl.
CPC ...
H01L 29/7827 (2013.01); H01L 27/0629 (2013.01); H01L 29/4236 (2013.01); H01L 29/66666 (2013.01);
Abstract

A semiconductor device includes an upper electrode; a lower electrode; a substrate positioned between the upper electrode and the lower electrode; a buried electrode part positioned between the substrate and the upper electrode, the buried electrode part including a gate electrode; and a silicon layer positioned between the substrate and the upper electrode. The silicon layer includes a mesa part next to the buried electrode part, a first region positioned between the mesa part and the substrate, and a second region positioned between the buried electrode part and the substrate. An energy level density of the first region is greater than an energy level density of the second region.


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