The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 09, 2024

Filed:

Sep. 01, 2020
Applicant:

Kioxia Corporation, Tokyo, JP;

Inventors:

Ryoichi Suzuki, Yokohama Kanagawa, JP;

Hirokazu Kato, Tokyo, JP;

Assignee:

Kioxia Corporation, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01); H01L 23/498 (2006.01); H01L 21/768 (2006.01); H01L 23/522 (2006.01); H01L 23/528 (2006.01); H01L 21/3213 (2006.01);
U.S. Cl.
CPC ...
H01L 24/43 (2013.01); H01L 21/32139 (2013.01); H01L 21/76885 (2013.01); H01L 23/49827 (2013.01); H01L 23/49894 (2013.01); H01L 23/5226 (2013.01); H01L 23/5283 (2013.01); H01L 24/49 (2013.01); H01L 2221/1068 (2013.01);
Abstract

According to one embodiment, a wiring fabrication method includes pressing a first template including a first recessed portion and a second recessed portion provided at a bottom of the first recessed portion against a first film to form a first pattern including a first raised portion, corresponding to the first recessed portion, and a second raised portion, corresponding to the second recessed portion. The second raised portion protrudes from the first raised portion once formed. After forming the first pattern, a first wiring, corresponding to the first raised portion, and a via, corresponding to the second raised portion, is formed using the first pattern.


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