The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 09, 2024
Filed:
Nov. 29, 2019
Applicant:
Amosense Co., Ltd., Chungcheongnam-do, KR;
Inventor:
Ji-Hyung Lee, Chungcheongnam-do, KR;
Assignee:
Amosense Co., Ltd., Chungcheongnam-Do, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/66 (2006.01); H01L 21/48 (2006.01); H01L 23/15 (2006.01); H01L 23/495 (2006.01); H01L 23/532 (2006.01);
U.S. Cl.
CPC ...
H01L 23/66 (2013.01); H01L 21/4821 (2013.01); H01L 23/15 (2013.01); H01L 23/49575 (2013.01); H01L 23/53228 (2013.01);
Abstract
A semiconductor package component and a semiconductor package including the same. More particularly, the present disclosure relates to a semiconductor package component for an RF power transistor and a semiconductor package including the same. Further particularly, it relates to a semiconductor package component for an RF power transistor and a semiconductor package including the same, capable of adjusting impedance matching of an RF transistor by connecting a die chip and a lead frame with a wire so that a length of the wire is reduced as much as the protruding height of the base substrate.