The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 09, 2024
Filed:
Jul. 26, 2021
Excellence Opto. Inc., Miaoli County, TW;
Fu-Bang Chen, Miaoli County, TW;
Chih-Chiang Chang, Miaoli County, TW;
Chang-Ching Huang, Miaoli County, TW;
Chun-Ming Lai, Miaoli County, TW;
Wen-Hsing Huang, Miaoli County, TW;
Tzeng-Guang Tsai, Miaoli County, TW;
Kuo-Hsin Huang, Miaoli County, TW;
EXCELLENCE OPTO. INC., Hsinchu Science Park, TW;
Abstract
A package substrate comprises first, second and third electrical test contacts, wherein the package substrate is provided with an upper element plane and a lower SMD electrode plane on two sides. The side edge of the upper element plane is provided with first and second electrodes of the main element and first and second electrodes of the secondary element. The main element of LED chip is electrically connected between the first and second electrodes of the main element, a parallel circuit secondary element is electrically connected between the first and second electrodes of the secondary element. The electrical characteristics of the main element of LED chip and the parallel circuit secondary element are measured through the first, second, and third electrical test contacts when electrically connected.