The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 09, 2024

Filed:

Oct. 07, 2021
Applicant:

Murata Manufacturing Co., Ltd., Nagaokakyo, JP;

Inventors:

Hideaki Kobayashi, Nagaokakyo, JP;

Kentaro Mikawa, Nagaokakyo, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H02H 1/00 (2006.01); H01F 27/28 (2006.01); H01F 27/29 (2006.01); H01F 27/40 (2006.01); H01F 41/04 (2006.01); H01G 4/40 (2006.01);
U.S. Cl.
CPC ...
H01F 27/2804 (2013.01); H01F 27/29 (2013.01); H01F 27/40 (2013.01); H01F 41/043 (2013.01); H01G 4/40 (2013.01); H01F 2027/2809 (2013.01);
Abstract

A circuit element includes a multilayer body including insulating substrates, a first coil conductor inside the multilayer body, and first and second outer electrodes and a ground electrode on outer surfaces of the multilayer body. The first coil conductor includes a winding axis extending in a stacking direction of the insulating substrates, the first coil conductor is connected to the first outer electrode, the second outer electrode, or the ground electrode, and the second outer electrode extends along a side surface of the multilayer body. An additional capacitance is generated between the second outer electrode and the first coil conductor. The second outer electrode includes first and second portions with different widths in a layer direction of the insulating substrates and the width of the second portion is larger than the width of the first portion.


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