The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 09, 2024

Filed:

Sep. 29, 2022
Applicant:

Hkc Corporation Limited, Shenzhen, CN;

Inventors:

Li Tang, Shenzhen, CN;

Baohong Kang, Shenzhen, CN;

Assignee:

HKC CORPORATION LIMITED, Shenzhen, CN;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G02F 1/1345 (2006.01); G02F 1/133 (2006.01); G02F 1/1362 (2006.01); H01L 27/12 (2006.01); H01L 25/00 (2006.01); H01L 23/538 (2006.01); G09G 3/36 (2006.01); G09G 3/00 (2006.01); H01L 23/498 (2006.01); H01L 25/18 (2023.01);
U.S. Cl.
CPC ...
G02F 1/13452 (2013.01); G02F 1/13306 (2013.01); G02F 1/13456 (2021.01); G02F 1/136286 (2013.01); G09G 3/035 (2020.08); G09G 3/3685 (2013.01); H01L 23/49838 (2013.01); H01L 23/5386 (2013.01); H01L 25/50 (2013.01); H01L 27/124 (2013.01); H01L 23/4985 (2013.01); H01L 23/5387 (2013.01); H01L 25/18 (2013.01);
Abstract

A chip on film, a display panel, and a method of manufacturing the display panel are provided. The chip on film includes a flexible film and a driver chip. The flexible film includes at least a first group of lines and a second group of lines. M lines of the first group of lines are electrically connected to pins of the driver chip to form driver lines; and N lines of the second group of lines are not electrically connected to any pin of the driver chip, serving as nominal lines. By arranging the nominal lines, a conventional bonding machine may be applied to bond the chip on film to the display substrate. Costs for modifying the bonding machine may be reduced, and application scenarios of the chip on film may be increased.


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