The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 09, 2024

Filed:

Sep. 23, 2021
Applicant:

Applied Materials, Inc., Santa Clara, CA (US);

Inventors:

Kang Luo, Santa Clara, CA (US);

Xiaopei Deng, San Jose, CA (US);

Daihua Zhang, Los Altos, CA (US);

Ludovic Godet, Sunnyvale, CA (US);

Assignee:

Applied Materials, Inc., Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G02B 5/18 (2006.01); G03F 7/00 (2006.01); G03F 7/16 (2006.01);
U.S. Cl.
CPC ...
G02B 5/1857 (2013.01); G03F 7/0005 (2013.01); G03F 7/16 (2013.01);
Abstract

Embodiments of the present disclosure generally relate to optical devices. More specifically, embodiments described herein relate to optical devices and methods of manufacturing optical devices having optical device structures with at least one of varying depths or refractive indices across the surface of a substrate. According to certain embodiments, an inkjet process is used to deposit a volumetrically variable optical device that is etched to form a diffractive optic element (DOE). Volumetrically variable can relate to the thickness of the optical device, or the relative volume of two or more diffractive materials deposited in combination. According to other embodiments, a single-profile DOE is deposited on a substrate and an inkjet process deposits a volumetrically variable organic material over the DOE. The DOE and organic material are etched to modify the profile of the structure, after which the organic material is removed, leaving the modified-profile DOE.


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