The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 09, 2024
Filed:
Nov. 02, 2021
Applicant:
City University of Hong Kong, Kowloon, HK;
Inventors:
Assignee:
City University of Hong Kong, Kowloon, HK;
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C22F 1/10 (2006.01); C22F 1/00 (2006.01); C22C 30/00 (2006.01); C22C 1/02 (2006.01); C22C 19/00 (2006.01);
U.S. Cl.
CPC ...
C22F 1/10 (2013.01); C22C 1/02 (2013.01); C22C 30/00 (2013.01); C22F 1/002 (2013.01); C22C 19/00 (2013.01);
Abstract
A method for preparing a high entropy alloy (HEA) structure includes the steps of: preparing an alloy by arc melting raw materials comprising five or more elements; drop casting the melted alloy into a cooled mold to form a bulk alloy; applying an external force against the bulk alloy to reshape the bulk alloy; and heat-treating the reshaped bulk alloy, wherein the bulk alloy is reshaped and/or heat-treated for manipulating the distribution of the microstructure therein. The present invention also relates to a high entropy alloy structure prepared by the method.