The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 09, 2024

Filed:

Mar. 22, 2021
Applicant:

Seiko Epson Corporation, Tokyo, JP;

Inventors:

Yasutoshi Hideshima, Nagano, JP;

Hidefumi Nakamura, Aomori, JP;

Makoto Kato, Nagano, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B22F 1/107 (2022.01); B22F 1/102 (2022.01); B22F 1/142 (2022.01); B22F 1/16 (2022.01); B22F 1/105 (2022.01); C22C 23/02 (2006.01);
U.S. Cl.
CPC ...
C22C 23/02 (2013.01); B22F 1/102 (2022.01); B22F 1/107 (2022.01); B22F 1/142 (2022.01); B22F 1/16 (2022.01); B22F 1/105 (2022.01); B22F 2301/058 (2013.01);
Abstract

A method for manufacturing a thixomolding material for thixomolding includes a drying step of heating a mixture containing a first powder that contains Mg as a main component, a second powder, a binder, and an organic solvent to dry the organic solvent contained in the mixture, and a stirring step of stirring the mixture heated in the drying step.


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