The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 09, 2024

Filed:

Dec. 04, 2019
Applicants:

Luoyang Institute of Cutting-edge Technology, Henan, CN;

Luoyang Cutting Edge Equipment Technology Ltd, Henan, CN;

Inventors:

Ruopeng Liu, Shenzhen, CN;

Zhiya Zhao, Shenzhen, CN;

Lu Zhang, Shenzhen, CN;

Yunxiang Zhang, Shenzhen, CN;

Yan Hou, Shenzhen, CN;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C09J 163/00 (2006.01); B05D 1/18 (2006.01); B05D 3/00 (2006.01); C09J 9/00 (2006.01); C09J 11/04 (2006.01); H05K 9/00 (2006.01); C08J 7/00 (2006.01); C08G 59/24 (2006.01); C08G 59/50 (2006.01); C08K 3/04 (2006.01); C08L 83/12 (2006.01);
U.S. Cl.
CPC ...
C09J 163/00 (2013.01); B05D 1/18 (2013.01); B05D 3/007 (2013.01); C08J 7/00 (2013.01); C09J 9/00 (2013.01); C09J 11/04 (2013.01); H05K 9/0081 (2013.01); B05D 2201/02 (2013.01); B05D 2504/00 (2013.01); C08G 59/245 (2013.01); C08G 59/502 (2013.01); C08G 59/5033 (2013.01); C08K 3/04 (2013.01); C08L 83/12 (2013.01); C09J 2301/50 (2020.08);
Abstract

Provided a wave-absorbing impregnation glue liquid, including: two-component epoxy resin, a solvent, a polyether siloxane, and a carbon powder; wherein a mass ratio of the two-component epoxy resin to the solvent is 1:3˜1:5, a mass ratio of the two-component epoxy resin to the carbon powder is 3:1˜6:1, and a mass fraction of the polyether siloxane in the wave-absorbing impregnation glue liquid is 0.05%˜0.2%. A wave-absorbing impregnation glue liquid, a wave-absorbing honeycomb and their preparation methods are further provided.


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