The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 09, 2024
Filed:
Sep. 26, 2018
Sekisui Chemical Co., Ltd., Osaka, JP;
Tokuyama Sekisui Co., Ltd., Osaka, JP;
Hiroshi Taniguchi, Yamaguchi, JP;
Tsukasa Gotou, Yamaguchi, JP;
SEKISUI CHEMICAL CO., LTD., Osaka, JP;
TOKUYAMA SEKISUI CO., LTD., Osaka, JP;
Abstract
The present invention provides a resin composition for molding that can provide a molded body having excellent thermal stability, high impact resistance, and high surface smoothness. The present invention also provides a molded body including the resin composition for molding. Provided is a resin composition for molding including: a chlorinated polyvinyl chloride; an acrylic processing aid; and an impact resistance modifier, the acrylic processing aid containing an acrylic resin having a weight average molecular weight of 500,000 to 5,000,000, the resin composition containing the acrylic processing aid in an amount of 0.2 to 10 parts by mass and the impact resistance modifier in an amount of 0.5 to 8.0 parts by mass relative to 100 parts by mass of the chlorinated polyvinyl chloride.