The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 09, 2024

Filed:

Jan. 09, 2023
Applicant:

Daikin Industries, Ltd., Osaka, JP;

Inventors:

Hirokazu Komori, Osaka, JP;

Junpei Terada, Osaka, JP;

Hiroyuki Sendan, Osaka, JP;

Tadahiro Yabu, Osaka, JP;

Yukihiro Fukagawa, Osaka, JP;

Kenta Murayama, Osaka, JP;

Tomohiro Shiromaru, Osaka, JP;

Toshio Miyatani, Osaka, JP;

Masahiro Kondou, Osaka, JP;

Hiroyuki Hamada, Osaka, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08K 3/36 (2006.01); B33Y 70/00 (2020.01); B29C 64/314 (2017.01); B29C 64/153 (2017.01); B33Y 70/10 (2020.01); B29K 27/18 (2006.01);
U.S. Cl.
CPC ...
C08K 3/36 (2013.01); B29C 64/153 (2017.08); B29C 64/314 (2017.08); B33Y 70/00 (2014.12); B33Y 70/10 (2020.01); B29K 2027/18 (2013.01);
Abstract

A molded body which is formed from a shaping material containing a fluororesin powder. The fluororesin powder has a D50 of 30 μm or more and 200 μm or less and a D10 of 12 μm or more. Also disclosed is a method for forming a molded body from a shaping material containing the fluororesin powder, the method including controlling the temperature of the fluororesin powder; and irradiating the fluororesin powder with a laser at the controlled temperature to fuse the same.


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