The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 09, 2024
Filed:
Mar. 28, 2018
Teijin Limited, Osaka, JP;
Tsukishima Kikai Co., Ltd., Tokyo, JP;
Tatsuya Ekinaka, Osaka, JP;
Tatsuichirou Kon, Osaka, JP;
Hiroshi Kishimoto, Osaka, JP;
Yume Takeda, Osaka, JP;
Takehiro Suga, Osaka, JP;
Satoshi Ogata, Tokyo, JP;
Masato Nakagomi, Tokyo, JP;
TEIJIN LIMITED, Osaka, JP;
TSUKISHIMA KIKAI CO., LTD., Tokyo, JP;
Abstract
The present invention is a polymer substrate with a hard coat layer, which is obtained by directly laminating a polymer substrate, a base cured layer and a silicon oxide layer, wherein the base cured layer has a thickness of 1-20 μm and contains 10-90 parts by weight of a polyfunctional acrylate and 90-10 parts by weight of inorganic oxide fine particles and/or a hydrolytic condensation product of a silicon compound or contains a hydrolytic condensation product of an organic silicon compound as a primary component, and the silicon oxide layer satisfies requirement (a1) below at a position 0.04 μm in the thickness direction from the interface between the base cured layer and the silicon oxide layer and satisfies requirement (a3) below at the surface of the silicon oxide layer on the opposite side from the interface,