The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 09, 2024

Filed:

Oct. 31, 2019
Applicant:

Hanwha Solutions Corporation, Seoul, KR;

Inventors:

Hyeonuk Kang, Daejeon, KR;

Do Hyun Byun, Daejeon, KR;

Kyongjun Yoon, Daejeon, KR;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08F 232/08 (2006.01); C08F 226/02 (2006.01); C08L 91/00 (2006.01); C09J 11/08 (2006.01); C09J 145/00 (2006.01);
U.S. Cl.
CPC ...
C08F 232/08 (2013.01); C08F 226/02 (2013.01); C08L 91/00 (2013.01); C09J 11/08 (2013.01); C09J 145/00 (2013.01); C09J 2301/312 (2020.08);
Abstract

The present invention relates to: a dicyclopentadiene-based resin having excellent compatibility with a base resin and prepared by being copolymerized with a monomer composition comprising a dicyclopentadiene-based monomer and a vinylamide-based monomer; a dicyclopentadiene-based hydrogenated resin; and an adhesive resin composition comprising same. A dicyclopentadiene-based resin according to the present invention is advantageous in terms of having excellent compatibility with various base resins and being providable as an adhesive resin composition capable of achieving remarkably improved adhesive strength.


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