The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 09, 2024
Filed:
Dec. 26, 2018
Applicants:
Sony Corporation, Tokyo, JP;
Tohoku University, Miyagi, JP;
Inventors:
Yoshihisa Sato, Saitama, JP;
Gen Yonezawa, Kanagawa, JP;
Shohei Abe, Shizuoka, JP;
Yuichi Takahashi, Kanagawa, JP;
Takehito Shimatsu, Miyagi, JP;
Miyuki Uomoto, Miyagi, JP;
Assignees:
SONY CORPORATION, Tokyo, JP;
TOHOKU UNIVERSITY, Miyagi, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 7/04 (2019.01); B23K 20/233 (2006.01); C03C 27/08 (2006.01); C03C 27/02 (2006.01);
U.S. Cl.
CPC ...
B32B 7/04 (2013.01); B23K 20/233 (2013.01); C03C 27/02 (2013.01); C03C 27/08 (2013.01); Y10T 428/12597 (2015.01);
Abstract
There is provided a functional element that includes a first substrate, a second substrate disposed to face the first substrate, and a buffer layer provided between the first substrate and the second substrate. The buffer layer has, in a layer thereof, a distribution of concentration of a metallic element. The distribution changes in a film thickness direction.