The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 09, 2024
Filed:
Aug. 22, 2019
The Boeing Company, Chicago, IL (US);
Marc R. Matsen, Seattle, WA (US);
Mark A. Negley, Kirkland, WA (US);
Landon K. Henson, Snoqualmie, WA (US);
John R. Hull, Sammamish, WA (US);
The Boeing Company, Arlington, VA (US);
Abstract
Disclosed herein is a method of forming a multi-layered metallic part. The method comprises stacking at least two metallic layers, each made of a metallic material having a ductility, to form a multi-layered metallic assembly. The method also comprises interposing a diffusion-bond preventing element directly between adjacent ones of the at least two metallic layers of the multi-layered metallic assembly. The method further comprises diffusion bonding the at least two metallic layers to each other at locations other than a location contiguous with the diffusion-bond preventing element to produce a multi-layered metallic part having a non-bonded region between the at least two metallic layers at the location of the diffusion-bond preventing element.