The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 09, 2024

Filed:

Aug. 30, 2019
Applicant:

Zhuhai Sailner 3d Technology Co., Ltd., Guangdong, CN;

Inventors:

Wei Chen, Guangdong, CN;

Dongqing Xiang, Guangdong, CN;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B29C 64/393 (2017.01); B33Y 10/00 (2015.01); B33Y 30/00 (2015.01); B33Y 80/00 (2015.01); B33Y 50/02 (2015.01);
U.S. Cl.
CPC ...
B29C 64/393 (2017.08); B33Y 10/00 (2014.12); B33Y 30/00 (2014.12); B33Y 50/02 (2014.12); B33Y 80/00 (2014.12);
Abstract

An illustrative example support structure includes a solid portion printed using a first material and a non-solid portion printed using a second material. The solid portion includes a grid structure, and both inside and outside of each grid unit of the grid structure are filled with the non-solid portion. Hardness of the first material is different from hardness of the second material. A grid density of the grid structure varies within a printing plane, and/or an area of a cross-section of a connecting edge of the grid unit varies in a direction perpendicular to the printing plane. There are differences in strength of different portions of the support structure of the present disclosure, so that an adverse effect of cracking of the support structure caused by a stress concentration phenomenon occurring when the support structure is subjected to a stress during or after a curing process can be effectively prevented.


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