The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 09, 2024

Filed:

Dec. 07, 2020
Applicant:

Sodick Co., Ltd., Kanagawa, JP;

Inventor:

Hiroki Hamaguchi, Kanagawa, JP;

Assignee:

Sodick Co., Ltd., Kanagawa, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B29C 45/80 (2006.01);
U.S. Cl.
CPC ...
B29C 45/80 (2013.01); B29C 2945/76096 (2013.01); B29C 2945/76227 (2013.01); B29C 2945/76391 (2013.01); B29C 2945/76581 (2013.01); B29C 2945/76709 (2013.01); B29C 2945/76869 (2013.01);
Abstract

A mold clamping device of an injection molding machine includes a mold clamping shaft fixed to a movable platen, a mold clamping ram to press the mold clamping shaft against a fixed platen, a ram position detecting member that detects a position of the mold clamping ram, an encoder detecting a position of the movable platen, a ram position control member that hydraulically controls a position of the mold clamping ram, a storage unit storing a difference value of mold closing positions of the movable platen before and after mold replacement, and a control unit. The control unit calculates the difference value when mold thickness adjustment is performed, calculates a movement position of the mold clamping ram based on a current position of the mold clamping ram and the difference value, moves the mold clamping ram to the movement position, and stops the mold clamping ram to perform mold clamping.


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