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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11865750 B1

PDFFull Text
Date of Patent:
Jan. 09, 2024

Filed:

Aug. 07, 2019

Composite structure and housing for electronic device

Applicant:

Mitsui Chemicals, Inc., Tokyo, JP;

Inventors:

Takahiro Tominaga, Ichihara, JP;

Kazuki Kimura, Sodegaura, JP;

Assignee:

MITSUI CHEMICALS, INC., Tokyo, JP;

Attorney:

Foley & Lardner LLP

Primary Examiner:

Christopher W Raimund

Int. Cl.
CPC ...
B29C 45/14 (2006.01); B29C 45/27 (2006.01); B29C 65/56 (2006.01); B29C 65/00 (2006.01); B29K 75/00 (2006.01); B29K 705/02 (2006.01); B29L 31/34 (2006.01);
U.S. Cl.
CPC ...
B29C 45/14467 (2013.01); B29C 45/2708 (2013.01); B29C 65/56 (2013.01); B29C 66/7422 (2013.01); B29K 2075/00 (2013.01); B29K 2705/02 (2013.01); B29K 2715/00 (2013.01); B29L 2031/3481 (2013.01);
Abstract

A composite structure includes: a metal member; and a thermoplastic resin member bonded to the metal member, in which the metal member has a fine uneven structure at least on a metal surface to which the thermoplastic resin member is bonded, a hardness of the thermoplastic resin member measured by a type A durometer in accordance with JIS K6253 is in a range of equal to or more than A60 and equal to or less than A95, and an acid value of the thermoplastic resin member is equal to or more than 1 mgKOH/g and equal to or less than 100 mgKOH/g. The thermoplastic resin member preferably contains a urethane-based thermoplastic elastomer, an amide-based thermoplastic elastomer, and an acid-modified polyolefin.

Find Patent Forward Citations

Tominaga, Takahiro. (2024). Composite structure and housing for electronic device (U.S. Patent No. 11865750). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11865750

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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