The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 09, 2024
Filed:
Mar. 22, 2021
Applicant:
Seiko Epson Corporation, Tokyo, JP;
Inventors:
Koichi Ozaki, Okayama, JP;
Tadao Fukuta, Kurashiki, JP;
Yasutoshi Hideshima, Nagano, JP;
Makoto Kato, Nagano, JP;
Assignee:
Seiko Epson Corporation, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B22F 1/148 (2022.01); B22F 1/068 (2022.01); B22D 17/00 (2006.01);
U.S. Cl.
CPC ...
B22D 17/007 (2013.01); B22F 1/068 (2022.01); B22F 1/148 (2022.01); B22F 2301/058 (2013.01); B22F 2302/40 (2013.01); B22F 2303/01 (2013.01); B22F 2303/20 (2013.01);
Abstract
A method for manufacturing a powder-modified magnesium alloy chip for thixomolding includes a drying step of heating a mixture containing an Mg chip containing Mg as a main component, a C powder containing C as a main component, a binder, and an organic solvent to dry the organic solvent contained in the mixture, and a stirring step of stirring the mixture heated in the drying step.