The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 02, 2024

Filed:

Oct. 29, 2021
Applicant:

Texas Instruments Incorporated, Dallas, TX (US);

Inventors:

Rafael Jose Lizares Guevara, Manila, PH;

Dok Won Lee, Mountain View, CA (US);

Kashyap Mohan, Irving, TX (US);

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
G01R 33/00 (2006.01); H10N 52/80 (2023.01); G01R 33/07 (2006.01); H10N 50/85 (2023.01); H10N 52/01 (2023.01); H10N 52/00 (2023.01);
U.S. Cl.
CPC ...
H10N 52/80 (2023.02); G01R 33/0011 (2013.01); G01R 33/07 (2013.01); H10N 50/85 (2023.02); H10N 52/01 (2023.02); H10N 52/101 (2023.02);
Abstract

A described example includes: a semiconductor die including a Hall sensor arranged in a first plane that is parallel to a device side surface of the semiconductor die; a passivated magnetic concentrator including a magnetic alloy layer formed over the device side surface of the semiconductor die, the upper surface of the magnetic alloy layer covered by a layer of polymer material; a backside surface of the semiconductor die opposite the device side surface mounted to a die side surface of a die pad on a package substrate, the semiconductor die having bond pads on the device side surface spaced from the magnetic concentrator; electrical connections coupling the bond pads of the semiconductor die to leads of the package substrate; and mold compound covering the magnetic concentrator, the semiconductor die, the electrical connections, a portion of the leads, and the die side surface of the die pad.


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